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Commodity: Conductive Silver Paste Silver Paint
No:
Description:

No.

Commodity

Element

Volume

Resistance values

Adhesive strength

Standard ripening
Condition

Component

Main purpose/ Specialty

*D1:Conductive Silver Paste 

D10015

AB

Ag

﹤1*10-4(Ω-cm)

≧10(N/mm2)

60℃*180

Min

Two-liquid type

Grain adhesive

D10025

18AB

Ag

﹤5*10-4(Ω-cm)

≧13(N/mm2)

60℃*180

Min

(Two)

 

D10035

80BS

Ag

﹤5*10-4 (Ω-cm)

≧16(N/mm2)

150℃*60

Min

Single liquid type

 

D10045

78BS

Ag

﹤5*10-4 (Ω-cm)

≧13(N/mm2)

150℃*60

Min

(One)

 

D10055

LBS

Ag

﹤5*10-4 (Ω-cm)

≧13(N/mm2)

70℃*60

Min

 

 

*D2:Insulation Adhesive

D20015

B9066

Black

﹥20(MΩ-cm)

≧16(N/mm2)

60℃*90

Min

Single liquid type

Insulation adhesive

D20025

W9077

White

﹥20(MΩ-cm)

≧16(N/mm2)

200℃*5

Min

(One)

 

D20035

R9088

Red

﹥20(MΩ-cm)

≧16(N/mm2)

150℃*30

Min

 

 

D20045

G8

Green

﹥20(MΩ-cm)

──

200℃*5

Min

──

Protective insulation

*D3:Thermally Conductive Glue

D30015

THAB

Ag

6.0W/mK

Dipping,Pin

60℃*180

Min

Two-liquid type(Two)

Insulation adhesive

D30025

GBSTC

Ag

7.0W/mK

Dipping,Pin

70℃*60

Min

Single liquid type(One)

Conductive,Radiating

D30035

ANAB

Mo

5.0W/mK

Dipping,Pin

60℃*180

Min

Two-liquid type(Two)

 

D30045

ANBSTC

Mo

5.0W/mK

Dipping,Pin

70℃*60

Min

Single liquid type(One)

 

*D4:Thermal paste

D40015

HDSTC

Ag

8.0W/mK

──

Non-

drying

Single liquid type(One)

Conductive,Radiating

D40025

ANSTC

Mo

6.0W/mK

──

Non-

drying

Single liquid type(One)

*D5:Touch panel /TFT-LCD /STN-LCD

D5001

80HR

Ag

80±2%

580±40

Screen

500±10℃

 

D5002

801HR

Ag

80±2%

700±40

Screen

500±10℃

D5003

801S

Ag

80±2%

700±40

Screen

500±10℃

D5004

3860

Ag

62±2%

300±40

Screen

120℃/30

Min

D5005

3865

Ag

63±2%

300±40

Screen

120℃/30

Min

*D6:Crystal Silicon Solar Cells

D6001

3688

Ag

85±1.5%

450±50

 Screen

700-750℃

Front circuitry good solder ability&

LeadedLow Resistivity

D6002

 9688

Ag

 83±1.5%

450±50

Screen

700-750℃

Front circuitry good solder ability& Lead freeLow Resistivity

D6003

1688

Ag/Al

78±3%

450±50

Screen

 700-750℃

Back Contact Lead freeLow Resistivity 

D6004

2688

Ag

78±3﹪

450±50

Screen

 700-750℃

D6005

 1699S

Al 

78±5%

450±50

 Screen

 700-750℃

Back ContactLead freeLow bowing

D6006

2699

Al

 78±5﹪

450±50

 Screen

700-750℃

 

 

 

 

 

 

 

 

No.

Commodity

Element

Volume resistance value

Viscosity

Standard curing

condition

Coating method

The main purpose / specialty

*D7:FPC Soft Circuit Board

D7001

4570

Ag

﹤6*10-5(Ω-cm)

16±2kcps

120℃*30

Min

Screen

Masking anti-magnetic wave

D7002

4560

Ag

﹤6*10-5(Ω-cm)

16±2kcps

120℃*30

Min

Screen

D7003

3850

Ag/C

﹤6*10-4(Ω-cm)

16±2kcps

120℃*30

Min

Screen

D7004

4550

Ag/C

﹤6*10-4(Ω-cm)

16±2kcps

120℃*30

Min

Screen

*D1001

AB

Ag

﹤1*10-4(Ω-cm)

≧10(N/mm2)

60℃*180Min

Two-liquid type(Two)

Grain adhesive

 D1005

LBS

Ag

﹤5*10-4 (Ω-cm)

≧13(N/mm2)

70℃*60Min

Single liquid type(One)

* D8:PCB Hard Circuit Board

D8001

3060S

Ag

﹤2*10-3(Ω-cm)

16±2kcps

150℃*30

Min

Screen

Silver Through Hole

D8002

3055S

Ag/C

﹤2*10-3(Ω-cm)

16±2kcps

150℃*30

Min

Screen

*D1001

AB

Ag

﹤1*10-4(Ω-cm)

≧10(N/mm2)

60℃*180Min

Two-liquid type(Two)

Grain adhesive

 D1005

LBS

Ag

﹤5*10-4 (Ω-cm)

≧13(N/mm2)

70℃*60Min

Single liquid type(One)

*D2003

R9088

Red

﹥20(MΩ-cm)

≧16(N/mm2)

150℃*30Min

Insulation adhesive

*D9:Membrane Switch / PET / PVC Mechanical Components

D9001

4555

Ag/C

﹤6*10-5(Ω-cm)

16±2kcps

150℃*30

Min

Screen

Wire

D9002

3850

Ag/C

﹤2*10-4(Ω-cm)

16±2kcps

150℃*30

Min

Screen

*D1001

AB

Ag

﹤1*10-4(Ω-cm)

≧10(N/mm2)

60℃*180Min

Two-liquid type(Two)

Grain adhesive

 D1005

LBS

Ag

﹤5*10-4 (Ω-cm)

≧13(N/mm2)

70℃*60Min

Single liquid type(One)

*D10:Electroform

D10-01

70A 

Ag

﹤1*10-4(Ω-cm)

5±2kcps

Room temp.

~80℃

Dipping

Good conductivity

& Plating ability

 

 

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